Wafer size: 150mm & 200mm & 300mm

Pillar, Bump, RDL, TSV, etc

Equipment configuration: -No or 2 load ports -8 or more plating chambers: Cu, Ni, Sn / Ag, Au -Type of electroplating solution: Cu, Ni, Sn / Ag, Au; -With the pre-wet chamber and the cleaning function; -Horizontal plating chamber, without cross- contamination -Support single chamber maintenance to improve equipment uptime -Rubber sealing technology, for better sealing performance -Cathode and anode separation technology , better stability Process index: high uniformity: WiW 5%, WtW 5%, RtR 5%